VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensed fluxes and emissions from assemblies. As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.

Advantages compared to other cleaning agents:

• Higher cleaning quality and process reliability
  • Improved cleaning performance
  • The medium does not contain any ingredients which could leave residues on the oven surfaces. This avoids harmful condensation on the assembly surfaces after restarts.
  • Excellent material compatibility with aluminum and epoxy surfaces
• Mild formulation
  • No flash point
  • High operator safety
  • Environmentally friendly
  • No special labeling is required
  • Little odor
• More efficient cleaning process to avoid long machine downtimes
  • Short soaking time due to advanced formulation
  • Can be applied directly onto cold or warm surfaces (20 – 50 °C / 68 – 122 °F)
  • Also suitable for the pre-cleaning of condensation traps